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Electroplating Technology for Through Silicon Via Copper

Araki,YujiAkazawa,KenichiKuriyama,FumioOwatari,AkiraThe Japan Institute of Electronics PackagingProceedings of JIEP Annual Meeting

Air–metal hydride secondary battery with long

A copper plated MmNi3.5Co0.7Al0.7Mn0.1 alloy was used as the activeChartouni D, Kuriyama N, Kiyokayashi T, et al.Air-metal hydride

Resistance and Creep Characteristics of Copper

Copper AlloyAir OxidationO_2 Plasma OxidationCreep CharacteristicEffect of Copper FUJII Kazumi , KOBAYASHI Shiro , IIJIMA Katumi , KURIYAMA Mituo ,

Chiral Amidophosphane—Copper-Catalyzed Asymmetric Conjugate

Fanny Valleix, Kazushige Nagai, Takahiro Soeta, Masami Kuriyama, Ken-ichiaddition of dialkylzinc to a mixture of copper–amidophosphane and nitro

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High-temperature thermoelectric properties of Delafossite

Chemosphere 46:779]]>copper compoundscrystal structuredopingthermal conductivityKuriyama K, Nohara M, Sasagawa T, Tabuko K, Mizokawa F, Kimura K

Superconducting magnet apparatus

United States Patent 5686876 Abstract: The Kuriyama, Toru (Yokohama, JP) Yazawa, Takashi The GM refrigerator 14 employs a copper mesh

Helical substituted polyacetylene structure, method for

20031220-United States Patent 8394506 Abstract: A helical STRUCTURE OF A POLYMER May, 2008 Kuriyama et alcopper complexes and nickel complexes;

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Plating apparatus and plating method for forming magnetic film

2011420-United States Patent 8877030 Abstract: A magnetic 20060113185 Plating apparatus 2006-06-01 Kuriyama such as copper plating, on a surf

Heat transfer tube for absorber

United States Patent 5590711 Abstract: A heat Ishida, Seiji (Hatano, JP) Kuriyama, Takashi copper tube (JIS H3300 C1201) having an outer

Synergetic effects of Ca 2+ and Cu 2+ on phase transition

Copper-induced peroxidation of phosphatidylserine-containing liposomes is Shirane, K.; Kuriyama, S.; Tokimoto, T. Synergetic Effects of Ca2+

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Apparatus for laser processing and monitoring

This allows increased monitoring accuracy so that an article such as copper Kuriyama, KatsuhiroOkada, ToshiharuUesugi, YujiMochida, ShoroYamaguchi,

Carbon dispersed copper-cobalt alloy nanoparticles: A cost-

201562-Copper(II) chloride dihydrate (CuCl2·2H2O), an associative mechanism at the transition state. Kuriyama, Q. Xu, J. Power Sources 191 (

Substrate plating apparatus

United States Patent 6294059 Abstract: A substrate Kuriyama, Fumio (Yokohama, JP) Tsujimura, copper layer on a surface of a semiconductor

SYNTHESIS, CRYSTAL STRUCTURE, AND PROPERTIES OF COPPER(II)

SYNTHESIS, CRYSTAL STRUCTURE, AND PROPERTIES OF COPPER(II) COMPLEXES WITH 1Shoichi HoriTaro KuriyamaChemistry Journal of Moldova&58; General

Degassing apparatus for a metal mold

2011819- for a metal mold 1987-09-08 Kuriyama et al.state is set to be larger than a valve closing Compressed air is normally used as the flui

Roller for electrophotographic apparatus

United States Patent 5893821 Abstract: A roller Kuriyama, Shigeo (Yokohama, JP) Noda, Yosuke copper, silver and germanium; and electro

Method and apparatus for plating a substrate

United States Patent 6544585 Abstract: A high Kuriyama, Fumio (Yokohama, JP) Hongo, Akihisa the volume of residual air is compressed and,

An immobile dislocation arrangement in as-grown copper single

position r inside the crystal (Kuriyama, 1967; Results 2 and 3 state that these lines lie incopper single crystals grown under particular growth

Plating apparatus

Kuriyama, Fumio (Tokyo, JP) Kimura, Masaaki (bumps) of gold, copper, solder, lead-free state is lowered, and air or inert gas is

autonomic dysfunction following anti-copper therapy in

Urai Y, Watanabe S, VTakeuchi H, Kuriyama S (2005) Improvement of cardiovascular autonomicdysfunction following anti-copper therapy in Wilson’s disease

ELECTROLESS COPPER PLATING DEVICE

ELECTROLESS COPPER PLATING DEVICE To provide an electroless copper plating SENDAI SATOSHIKOGURE NAOAKIKURIYAMA FUMIOIKEGAMI TETSUMASAOKUYAMA SHUICHI

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